新竹縣竹北市5年以上大學以上
【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表:
https://careers.qualcomm.com/careers/job/446704838148
【Talents who apply job through Qualcomm Career Website will be reviewed and considered as top priority】
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Minimum Qualifications:
• Bachelor's degree in computer science, Electrical/Electronic Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
OR
Master's degree in computer science, Electrical/Electronic Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronic Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Product and Test Development Engineering (PDTE) is looking for Digital Structural Test Engineer / Lead, who will create test solutions for New Product Introduction (Silicon Validation and Characterization) and Manufacturing Enablement of Qualcomm Silicon on Chip (SOC) products.
The position offers growth/specialization opportunities within Digital Test Engineering (Structural SCAN and MBIST). The individuals selected for the positions will need to be able to work in a fast paced and dynamic environment and be passionate about delivering quality work.
As a Digital Structural Test Engineer/Lead, you will
• Be involved in pre-silicon planning
• Bring-up ATPG/TDF/MBIST test content on different Product Tiers and Technology Node
• Work with other Test Engineers, Design-For-Test, Designers, Product Engineers to solve NPI and High-Volume Manufacturing Issues
• Analyze data, provide recommendations, participate in decision making process related to Testing
• Develop efficiency solutions via automation or workflow enhancements
• Propose and Develop test solutions via test methods or new workflows for Test Time Reduction, Yield Improvement, or Thermal Issue Resolution/Prevention
• Guide and Train new engineers
• Lead a team
Requirements
• Bachelor’s degree in electrical/Electronic Engineering, Computer Science, or related field. Master of Electrical Engineering Preferred.
• Minimum 8 years of industry experience as a Test Engineer with hands on experience on Advantest 93K/Teradyne UFlex
• Proficient programming language such as C++/Java/Python
• Experienced with data analysis tools such as O+, Data Power, Exensio
• Experienced in Digital Testing
• Ability to summarize data and provide recommendations
Preferred
• Has experience in leading a team of at least 3 engineers
• Excellent English communication