1.Layuot設計,PCB發包製作,SMT/DIP發包製作。
2.研究製作PCB產品相關分析與報告。
3.協助技術文件編寫。
Job Description
1.Layout design, PCB outsourcing and production, SMT/DIP outsourcing and production.
2.Research and create analyses and reports related to PCB product manufacturing.
3.Assist in the preparation of technical documents.
Job Description:
1. Discuss and communicate with cross function teams.
2. Based on design guide to set up constraints manager.
3. Independent completion of the project.
4. Be able to use Cadence's Allegro.
5. have 10-layers &+ PCB board layout experiences.
The information we collect:
We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.