Job Summary:
• This FAE will provide technical support to the Sales and FAE team in developing potential opportunities incorporating MPS products and services. The FAE identifies and shares current and emerging customer technical needs to improve the tactical and strategic product positioning.
Qualifications:
• 2 years' experience in power electronics (DC/DC or AC/DC) related industry; experience in Power IC vendor as AE or FAE will be a plus.
• Familiar with general NB/Server DCDC Power Design or DCDC will be a plus.
• Ability of initiating and problem solving.
• Good interpersonal skills.
• Adaptability-ability to meet changing condition.
• Strong sense of responsibility, self-motivated and good team spirit.
Education:
• BS or MS majored in Electronic Engineering or related.
Location:
• Taipei, Taiwan
1. Provide the latest information on product specifications and applications in the market as a reference for customers when designing products;
2. Assist product line technical support and business promotion;
3. Understand the customer industry, industry competition and market conditions by interacting with customers;
4. Actively understand customer needs and respond quickly;
5. Performs duties well, supports team decision, and achieves common goals
About the job :
Application engineer is responsible for tech support to customers. Externally, it is act as technical interface with customers to provide solutions and technical trainings through TSC Academy. Internally, it is the bridge between customer and internal R&D engineering teams. The role of Application Engineer is not only to provide the high-quality technical support for products, but also needs to manage both customer relationships and the technical solution of customer’s requests, deliver customer and partner experience through timely response, cross departments collaboration and execution to engage the projects.
Responsibilities:
- Technical support, including pre-sales/post-sales scoping, troubleshooting, solution providing and close case to engage the projects.
- Collaborate effectively with internal relevant departments for the solution.
- Collect and report the customer feedback and market competitor info
- On-site support key customers to resolve the issues.
- Technical training/partner events for Sales and partners.
- New project product ECAT testing according to user experience.
Responsibilities include:
1. Lead team or act the staff role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center.
2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design.
3. Experiences for Linux embedded board bring up and debugging.
4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish.
5. Lead for schematic circuit design and PCB layout review.
6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature
7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback .
8. Signal integrity and power integrity measurement and verification.
9. Support RFI and RFQ activities and provide technical proposal.
10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer.
Requirements:
• BS in Electrical Engineering or related field. Prefer MS degree or above
• 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role.
• Demonstrated strong leadership for product design in multiple-disciplinary environment.
• Competence in customer focus innovation and able to drive technology growth
• Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must.
• Cadence Orcad capture or Mentor PADS capture.
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